From design and rapid prototyping to small-batch pilot runs — get your liquid cooling design validated faster.
Guangdong Hyeverk Tech. focuses on data center liquid cooling. With liquid cold plate design and rapid prototyping at our core, we help server makers, chip companies and liquid-cooling integrators bring next-generation, high-heat-flux products to market faster — with small-batch pilot production available once a design is validated.
Three services, one line: get the design right and fast — then validate it at small batch.
Thermal and flow-channel design driven by your chip's power, heat flux and hotspot map — optimizing thermal resistance within your pressure-drop budget, with design-for-manufacturing built in from day one.
A prototyping workflow built for design iteration: quick-turn samples across multiple revisions, each delivered with measured thermal-resistance, pressure-drop and leak-test data — so design decisions are driven by data, not guesswork.
After design freeze, we run small-batch pilot production with the same process and test standards as the prototyping stage — real pilot data to support your next-step decisions.
You provide the design inputs — we return samples and data.
Chip power and package size, temperature targets, coolant type and inlet temperature, flow-rate and pressure-drop budgets, envelope and connector specs.
Thermal design and flow-channel proposal with simulation results — expected thermal resistance and pressure drop — for your approval before prototyping.
Samples built to the approved design, with key process validation along the way.
Measured thermal resistance, pressure drop and leak integrity — delivered as a test report together with the samples.
Fast design revisions based on measured data, until performance and cost targets are met.
Small-batch pilot delivery, with the same process and test standards as the validated prototypes.
Our customers include server ODMs/OEMs, chip and ASIC companies, and CDU / liquid-cooling system integrators. They work with us for practical reasons:
Send us your design inputs — chip power, envelope, flow and pressure-drop budgets — and we will reply with a design direction and prototyping lead time.